Advanced silicon design improves tag performance
October 1st 2006

Using an advanced silicon design that improves tag performance and is faster, Texas Instruments has announced the availability of its EPCglobal Inc certified Generation 2 ultra-high frequency (UHF) silicon.

Offering greater design flexibility to customers, TI is providing its Gen 2 silicon to inlay, label and packaging manufacturers in three forms: bare wafers to support various assembly processes; processed wafers (bumped, sawn with back grind) suitable for immediate use with commercially available inlay equipment; and silicon chip on straps for label and packaging manufacturers who are printing their own antennas.

TI is also offering reference antenna designs enabling customers to develop labels and tags which optimise its Gen 2 silicon. TI's Gen 2 silicon is intended for use in the manufacture of passive RFID tag products operating in the 860 to 960 MHz.

More articles from Texas Instruments Ltd: